Heat dissipating RF electronics housing



FIG. 1 is a perspective photographic view from a first side of the electronics housing according to the invention.

FIG. 2 is a perspective photographic view from the opposite side of the housing according to FIG. 1.

FIG. 3 is a top photographic view of the housing according to FIG. 1.

FIG. 4 is a side photographic view of the housing according to FIG. 1.

FIG. 5 is a perspective photographic view from an end of the housing according to FIG. 1.

FIG. 6 is an end view of the housing according to FIG. 5; and,

FIG. 7 is a photographic view of the bottom of the housing according to FIG. 1. 

The ornamental design for a heat dissipating RF electronics housing, as shown and described. 